Alpha and Omega Semiconductor Limited, a designer, developer and global supplier of a broad range of power semiconductors and power ICs, today announced that it has entered into a preliminary agreement with the state authority of Chongqing, China, to form a joint venture for a new state-of-the-art power semiconductor manufacturing facility in the Liangjiang New Area of Chongqing.

Under the proposed agreement, the initial capitalization of the joint venture is expected to be approximately $300 million. The Chongqing authority would own 49% of the venture’s equity and invest in cash. AOS would own 51% of the equity and contribute primarily its existing assembly and testing equipment as well as certain intellectual property related to the operation of the facility.

“We are excited that this joint venture with the authority of Chongqing offers the prospect of creating new competitive advantages that can fuel growth for both Chongqing and AOS,” said Dr. Mike Chang, chairman and CEO of AOS.

“We expect the venture to deliver significant cost savings for AOS and allow us to reduce our tangible assets as well as drive meaningful improvements in working capital and capital expenditures. We believe this partnership will open doors to new customers and expand our sales in China, and particularly in the Chongqing area. The venture represents an important step in our continuing strategy to improve long-term profitability by accelerating growth, reducing costs, and diversifying our offerings of power semiconductor products.”

The joint venture is expected to begin manufacturing operations in 2017. AOS will gradually move its assembly and testing equipment from the company’s existing facility in Shanghai to the lower-cost Chongqing region. We expect our AOS Shanghai will continue as a company’s supply chain management center and technology center for high-value products. At a later date, the joint venture expects to construct a 12-inch fabrication facility that is suited for the production of power semiconductors.

The parties are negotiating a definitive joint venture agreement setting forth in more detail the financial and business terms, as well as the timeline, of the proposed project, which is expected to be a multi-year commitment divided into several stages. The execution of the joint venture agreement will be subject to various conditions, including the relevant government agency review and approval.

  • Transforms Dialog into a global leader in both Power Management and Embedded Processing with $2.7 billion of combined revenues (1)
  • Diversifies customer base across Mobile Power, IoT and Automotive markets
  • Combines leadership positions in Power Management, Microcontrollers (MCUs), Connectivity and Security to deliver comprehensive Internet of Things (IoT) platforms
  • $150 million of projected annual cost synergies expected to be achieved within two years
  • Combination is expected to be accretive to underlying EPS in 2017, the first full year following closing.

 

Dialog Semiconductor and Atmel Corporation announced today that Dialog has agreed to acquire Atmel in a cash and stock transaction for total consideration of approximately $4.6 billion. The acquisition creates a global leader in both Power Management and Embedded Processing solutions. The transaction results in a fast growing and innovative powerhouse, supporting Mobile Power, IoT and Automotive customers. The combined company will address an attractive, fast growing market opportunity of approximately $20 billion by 2019. Dialog will complement its leadership position in Power Management ICs with a leading portfolio of proprietary and ARM® based Microcontrollers in addition to high performance ICs for Connectivity, Touch and Security. Dialog will also leverage Atmel’s established sales channels to significantly diversify its customer base. Through realized synergies, we expect the combination will deliver an improved operating model and enable new revenue growth opportunities.

“The rationale for the transaction we are proposing today is clear – and the potential this combination holds is exciting. By bringing together our technologies, world-class talent and broad distribution channels we will create a new, powerful force in the semiconductor space. Our new, enlarged company will be a diversified, high-growth market leader in Mobile Power, IoT and Automotive. We firmly believe that by combining Power Management, Microcontrollers, Connectivity and Security technologies, we will create a strong platform for innovation and growth in the large and attractive market segments we serve. This is an important and proud milestone in the evolution of our Dialog story,”

said Jalal Bagherli, Dialog Chief Executive Officer.

“This transaction combines two successful companies and will create significant value for Atmel and Dialog shareholders, customers and employees. Adding Dialog’s world-class capabilities in Power Management with Atmel’s keen focus on Microcontrollers, Connectivity and Security will enable Dialog to more effectively target high-growth applications within the Mobile, IoT and Automotive markets,” said Steven Laub, Atmel President and Chief Executive Officer.

In 2017, the first full year following closing, the transaction is expected to be accretive to Dialog’s underlying earnings. Dialog anticipates achieving projected annual cost savings of $150 million within two years.

Cree, Inc. a leader in silicon carbide (SiC) power products and gallium nitride (GaN) radio frequency (RF) devices, today announced that Wolfspeed is the new name for the Power and RF division of Cree. The company announced in May that it would separate the business into a standalone company.

“Cree’s pioneering technology and resulting broad patent portfolio has significantly advanced performance in LED and LED Lighting products. Cree is pleased to enter into this LED chip license agreement with Epistar, a leading chip innovator and manufacturer of LEDs used by packagers and lighting companies,”

said Chuck Swoboda, Cree Chairman and CEO. “This agreement underscores both companies’ commitment to accelerating the adoption of LED lighting while respecting the value and importance of international intellectual property laws.”

Founded upon the mission to liberate power and wireless systems from the limitations of silicon, Wolfspeed enters the marketplace as a well-established, entrepreneurial growth company with a focused team, a profitable business and more than 28 years of industry-leading wide bandgap semiconductor technology and experience.

The new name combines important elements of Cree’s culture and expertise and allows the Power and RF division to build brand equity while operating as a separate business. As a Cree Company, Wolfspeed will leverage Cree’s industry-leading brand, global footprint, scale and expertise to ensure a smooth transition for customers.

Wolfspeed acknowledges Cree’s inception at North Carolina State University and invokes the values that are integral to Cree, including intelligence, teamwork, endurance and the relentless pursuit of innovation. The name also highlights speed, which is both a differentiating attribute of Cree’s technologies and a promise to its customers and partners, who can expect the new company to set an industry standard for innovation, agility and responsiveness.

“Today, Wolfspeed is providing our customers and our team with a first look at our new company’s name, brand identity and purpose in advance of our IPO, which we plan to execute during fiscal year 2016,”

said Frank Plastina, chief executive officer, Wolfspeed.

“We’re building something new on the firm foundation that is Cree,” Plastina added, “and we want to share our vision, plans and enthusiasm with all of our stakeholders as we move seamlessly through the transition.”

As the only player in the industry with a fully commercialized, broad portfolio of the most field-tested SiC and GaN power and wireless technologies and products on the market, Wolfspeed™ will power its customers’ innovations, enabling higher power density, higher switching frequencies and reduced system size and weight. These advantages lead to smaller systems, lower system costs and improved performance, and will ultimately lead to more powerful applications in the transportation, industrial and electronics, energy, and communications markets, helping Wolfspeed achieve its vision of becoming the world’s leading wide bandgap semiconductor electronics company.

 aPSI3D (agile Power Switch 3D-Integration), a start-up specialized in Electronic Low Inductance High Power Modules which enables compacter, lighter and more efficient electrical power inverters, announced that it has raised €1.5 million in first-round financing that will be used to develop, industrialize and manufacture its highly integrated, high-speed power switching modules, whose key differentiation is evidenced at high voltage (>300V) and high power (>10kVA).

APSI 3D power module packaging power electronics

The investors are two leading French venture funds with a track record of identifying and fostering promising, fast-growth, early-stage technology companies:

  • IRDInov, a regional seed investor in emerging, fast-growth companies
  • CEA investissement, a fund manager focused on technology companies, which invested via the CEA strategic fund.

Bpifrance also provided continuous financial support to aPSI3D, starting prior to this first round of venture-fund backing. Thanks to technology partnerships with CEA Tech and IRT Saint Exupéry, and as a member of PRIMES innovation platform in Tarbes, aPSI3D has access to a complete array of state-of-the-art power electronics talents and tools. European aeronautics has a long legacy in Toulouse, and automotive power electronics was launched there.

aPSI3D‘s solution derives from fifteen years of research and development. 3D-stacking, double side cooling, and wire-bondless technology are the key levers to fourfold better compactness and lightness. The transition to industrial manufacturing is kept straightforward, due to its standard bill of material, and provides aPSI3D a competitive advantage because its embedded paradigm shift requires processes out of current back-end players’ know-how. Eco-mobility drives new keywords: autonomy, weight and volume.

« Wide bandgap semiconductor dies (SiC and GaN), which promise highly reduced heat dissipations, let users dream of simplified applications. Nevertheless, usual power modules have too much inductance for a relevant utilisation of such new generation dies at large power levels. This is where our innovative modules become necessary. »

Jacques FAVRE, aPSI3D‘s CEO and co-founder, explains.

«Our products are developed in close cooperation with die manufacturers selected for their advanced and proven technology; with our solution, they can multiply their die value over a wide range of higher value, cost competitive products. »

Once its customers confirm qualification, aPSI3D will be able to ramp-up production.

Epistar Corporation and ALLOS Semiconductors today announced the successful conclusion of their project to establish ALLOS’ mature 150 and 200 mm GaN-on-Si technology at Epistar. The project was executed with better than expected results and ahead of schedule in less than six months. For example excellent and reproducible crystal quality was achieved with total dislocation density value of 2×108 cm-2. With this performance Epistar has caught up with the world leading results of forerunners which have been developing GaN-on-Si LED technology for a long time.

During the project ALLOS established its GaN-on-Si epiwafer process on Epistar’s epitaxy reactors. Epistar engineers were trained and worked in the integrated project team with ALLOS to gain full understanding and control over the GaN-on-Si technology. Currently Epistar’s own leading LED technology is been transferred to GaN-on-Si structures.

“To conduct the technology transfer with ALLOS has proven to be the right decision for Epistar as it allowed us to quickly gain command over their leading GaN-on-Si technology in a very cost-efficient and reliable way”

says Dr. M. J. Jou, President of Epistar Corporation, and continues

“In a second phase we will now be focussing on realising the cost advantages of GaN-on-Si LEDs and to unlock the application benefits.”

“To accomplish a project of this size and complexity with such results is a complete success and a good reason to be proud of the teams from both parties”

comments Burkhard Slischka, CEO and Co-founder of ALLOS and further explains “This result underlines ALLOS’ project execution skills as well as our technical capabilities to grow crack free wafers with market leading crystal quality. This is an example that our fast, cost-effective and successful implementation of GaN-on-Si helps our customers to reduce development risk and to save time and money.”

Ideal Power Inc., a developer of advanced power conversion technologies, released a white paper describing a new power semiconductor switch called the Bi-directional Bipolar Junction TRANsistor (B-TRAN) and its method of operation as well as the implications of the B-TRAN as a replacement for conventional power switches.

The technical whitepaper describing the device structure and operation of the B-TRAN is available at B-TRAN White Paper.

Ideal Power was granted five U.S. patents, for the B-TRAN device and its methods of operation. Additional U.S. and international patents are pending. The B-TRAN device has a simple, 3 layer, 4 terminal, vertically symmetric double sided structure which presents unique opportunities for high current density operation at high efficiency. B-TRANs have potential uses in a wide range of power conversion and control applications, including very low loss AC power control and in power converters from Ideal Power and other power converter OEMs.

“Given the performance predictions for this new power switch topology, the B-TRAN may be the most significant new type of power semiconductor since the introduction of the IGBT,” says Dr. Richard Blanchard, a B-TRAN co-inventor and holder of over 200 patents primarily related to power semiconductors including the widely used trench MOSFET.

“These B-TRAN patents, along with other pending Ideal Power patents covering methods of double sided power switch manufacturing and operation, extend our intellectual property portfolio into power semiconductors, which we believe could significantly improve power conversion efficiency in a wide range of applications including AC power control, Ideal Power’s Power Packet Switching Architecture (PPSA) topology, conventional power converters and non-conventional power converters,” stated Bill Alexander, Chief Technology Officer, founder of Ideal Power and a B-TRAN co-inventor.

“High efficiency power converters deliver more power for the customer resulting in potentially lower cost, more reliable and smaller products. Ideal Power’s current products using standard IGBTs already deliver some of the highest efficiencies for energy storage applications and the Company believes that future Ideal Power products using B-TRANs could have full power conversion efficiencies equal to or exceeding 99 percent, as compared with conventional power conversion systems with typical full power efficiencies of less than 95 percent. Third party simulations show that, when applied to AC power control, the B-TRAN is predicted to operate with less than 20% of the conduction losses of conventional solid state AC power control devices while providing valuable fault control capabilities such as current limiting and fast turn-off during fault conditions, which are lacking in such conventional devices. The B-TRAN could also potentially replace electro-mechanical contactors in many applications where fault limiting and explosion-proof operation is required.”

The development of the B-TRAN has been supported by a U.S. Department of Energy Advanced Research Projects Agency – Energy (ARPA-E) award to create new bi-directional IGBT (BD-IGBT) power switches. Unlike conventional uni-directional power switches, bi-directional switches conduct current and block voltage in both directions. As part of this advanced research, the Company patented the B-TRAN, which combines the bi-directional functionality of the BD-IGBT with exceptionally low losses. Both the BD-IGBT and the B-TRAN have been extensively studied in detailed, physics-based simulations, and the semiconductor processes to build prototype devices are in development. These simulations show a 0.2 V drop on a 1200 V B-TRAN at high current density and gain greater than 10, as compared to a typical IGBT with series diode voltage drop of 4.5 V, for a factor of 22 reduction in conduction losses in IGBT AC switch applications. B-TRAN switching losses are predicted by these simulations to be significantly lower than IGBTs.

Nano-electronics research center imec announced today that it is extending its Gallium Nitride-on-Silicon (GaN-on-Si) R&D program, and is now offering joint research on GaN-on-Si 200mm epitaxy and enhancement mode device technology. The extended R&D initiative includes exploration of novel substrates to improve the quality of the epitaxial layers, new isolation modules to increase the level of integration, and the development of advanced vertical devices. Imec welcomes new partners interested in next generation GaN technologies and companies looking for low-volume manufacturing of GaN-on-Si devices to enable the next generation of more efficient and compact power converters.

GaN technology offers faster switching power devices with higher breakdown voltage and lower on-resistance than silicon, making it an outstanding material for advanced power electronic components. Imec’s R&D program on GaN-on-Si was launched to develop a GaN-on-Si process and bring GaN technology towards industrialization. Building on imec’s excellent track record in GaN epi-layer growth, new device concepts and CMOS device integration, imec has now developed a complete 200mm CMOS-compatible GaN process line. Imec’s GaN-on-Si technology is reaching maturity, and companies can gain access to the platform by joining imec’s GaN-on-Si industrial affiliation program (IIAP). The process line is also open to fabless companies interested in low-volume production of GaN-on-Si devices tailored to their specific needs, through dedicated development projects.

Imec’s portfolio includes three types of buffers optimized for breakdown voltage and low traps-related phenomena (i.e. current dispersion): a step graded AlGaN buffer, a super lattice buffer, and a buffer with low-temperature AlN interlayers. Imec explored side-by-side enhancement mode power devices of the MISHEMT and p-GaN HEMT type, as well as a gate-edge terminated Schottky power diode featuring low reverse leakage and low turn-on voltage.

The latest generation of imec enhancement mode power devices shows a threshold voltage beyond +2V, an on-resistance below 10 ohm mm and output current beyond 450 mA/mm. These devices represents the state of the art of enhancement mode power devices.

In this next phase of the GaN program, imec is focusing on further improving the performance and reliability of its current power devices, while in parallel pushing the boundaries of the technology through innovation in substrate technology, higher levels of integration and exploration of novel device architectures.

“Since the program’s launch in July 2009, we have benefited from strong industry engagement, including participation from IDMs, epi-vendors and equipment and material suppliers. This underscores the industrial relevance of our offering,”

stated Rudi Cartuyvels, executive vice president of smart systems at imec.

“Interested companies are invited to become a partner and actively participate in our program. Imec’s open innovation model allows companies to have early access to next-generation devices and power electronics processes, equipment and technologies and speed up innovation at shared cost.”

An exotic material called gallium nitride (GaN) is poised to become the next semiconductor for power electronics, enabling much higher efficiency than silicon.

In 2013, the Department of Energy (DOE) dedicated approximately half of a $140 million research institute for power electronics to GaN research, citing its potential to reduce worldwide energy consumption. Now MIT spinout Cambridge Electronics Inc. (CEI) has announced a line of GaN transistors and power electronic circuits that promise to cut energy usage in data centers, electric cars, and consumer devices by 10 to 20 percent worldwide by 2025.

Power electronics is a ubiquitous technology used to convert electricity to higher or lower voltages and different currents — such as in a laptop’s power adapter, or in electric substations that convert voltages and distribute electricity to consumers. Many of these power-electronics systems rely on silicon transistors that switch on and off to regulate voltage but, due to speed and resistance constraints, waste energy as heat.

CEI’s GaN transistors have at least one-tenth the resistance of such silicon-based transistors, according to the company. This allows for much higher energy-efficiency, and orders-of-magnitude faster switching frequency — meaning power-electronics systems with these components can be made much smaller. CEI is using its transistors to enable power electronics that will make data centers less energy-intensive, electric cars cheaper and more powerful, and laptop power adapters one- third the size — or even small enough to fit inside the computer itself.

“This is a once-in-a-lifetime opportunity to change electronics and to really make an impact on how energy is used in the world,” says CEI co-founder Tomás Palacios, an MIT associate professor of electrical engineering and computer science who co-invented the technology.

Other co-founders and co-inventors are Anantha Chandrakasan, the Joseph F. and Nancy P. Keithley Professor in Electrical Engineering, now chair of CEI’s technical advisory board; alumnus Bin Lu SM ’07, PhD ’13, CEI’s vice president for device development; Ling Xia PhD’12, CEI’s director of operations; Mohamed Azize, CEI’s director of epitaxy; and Omair Saadat PhD ’14, CEI’s director of product reliability.

Making GaN feasible

While GaN transistors have several benefits over silicon, safety drawbacks and expensive manufacturing methods have largely kept them off the market. But Palacios, Lu, Saadat, and other MIT researchers managed to overcome these issues through design innovations made in the late 2000s.

Power transistors are designed to flow high currents when on, and to block high voltages when off. Should the circuit break or fail, the transistors must default to the “off” position to cut the current to avoid short circuits and other issues — an important feature of silicon power transistors.

But GaN transistors are typically “normally on” — meaning, by default, they’ll always allow a flow of current, which has historically been difficult to correct. Using resources in MIT’s Microsystems Technology Laboratory, the researchers — supported by Department of Defense and DOE grants — developed GaN transistors that were “normally off” by modifying the structure of the material.

To make traditional GaN transistors, scientists grow a thin layer of GaN on top of a substrate. The MIT researchers layered different materials with disparate compositions in their GaN transistors. Finding the precise mix allowed a new kind of GaN transistors that go to the off position by default.

“We always talk about GaN as gallium and nitrogen, but you can modify the basic GaN material, add impurities and other elements, to change its properties,” Palacios says.

But GaN and other nonsilicon semiconductors are also manufactured in special processes, which are expensive. To drop costs, the MIT researchers — at the Institute and, later, with the company — developed new fabrication technologies, or “process recipes,” Lu says. This involved, among other things, switching out gold metals used in manufacturing GaN devices for metals that were compatible with silicon fabrication, and developing ways to deposit GaN on large wafers used by silicon foundries.

“Basically, we are fabricating our advanced GaN transistors and circuits in conventional silicon foundries, at the cost of silicon. The cost is the same, but the performance of the new devices is 100 times better,” Lu says.

Major applications

CEI is currently using its advanced transistors to develop laptop power adaptors that are approximately 1.5 cubic inches in volume — the smallest ever made.

Among the other feasible applications for the transistors, Palacios says, is better power electronics for data centers run by Google, Amazon, Facebook, and other companies, to power the cloud.

Currently, these data centers eat up about 2 percent of electricity in the United States. But GaN-based power electronics, Palacios says, could save a very significant fraction of that.

Another major future application, Palacios adds, will be replacing the silicon-based power electronics in electric cars. These are in the chargers that charge the battery, and the inverters that convert the battery power to drive the electric motors. The silicon transistors used today have a constrained power capability that limits how much power the car can handle. This is one of the main reasons why there are few large electric vehicles.

GaN-based power electronics, on the other hand, could boost power output for electric cars, while making them more energy-efficient and lighter — and, therefore, cheaper and capable of driving longer distances. “Electric vehicles are popular, but still a niche product. GaN power electronics will be key to make them mainstream,” Palacios says.

Innovative ideas

In launching CEI, the MIT founders turned to the Institute’s entrepreneurial programs, which contributed to the startup’s progress. “MIT’s innovation and entrepreneurial ecosystem has been key to get things moving and to the point where we are now,” Palacios says.

Palacios first earned a grant from the Deshpande Center for Technological Innovation to launch CEI. Afterward, he took his idea for GaN-based power electronics to Innovation Teams (i-Teams), which brings together MIT students from across disciplines to evaluate the commercial feasibility of new technologies. That program, he says, showed him the huge market pull for GaN power electronics, and helped CEI settle on its first products.

“Many times, it’s the other way around: You come out with an amazing technology looking for an application. In this case, thanks to i-Teams, we found there were many applications looking for this technology,” Palacios says.

For Lu, a key element for growing CEI was auditing Start6, a workshop hosted by the Department of Electrical Engineering and Computer Science, where entrepreneurial engineering students are guided through the startup process with group discussions and talks from seasoned entrepreneurs. Among other things, Lu gained perspective on dividing equity, funding, building a team, and other early startup challenges.

“It’s a great class for a student who has an idea, but doesn’t know exactly what’s going on in business,” Lu says. “It’s kind of an overview of what the process is going to be like, so when you start your own company you are ready.”

 

Download the GaN players map

 

 

Source: MIT news

ROHM Co., a Kyoto based global leader in analog power IC solutions, announced today that it has completed the acquisition of Powervation Ltd., a Start-up power IC company that develops Digital Power Management system-on-chip (SoC) solutions for approximately $70M, in an all-cash transaction.

The strategic combination of Powervation’s Intelligent Digital Powerplatform with ROHM’s leading analog power technology and global market access will enable the company to address a broad range of fast growing market opportunities, as customers increasingly adopt digital power solutions to power next generation high density systems and ICs such as Processors, Memory, FPGAs and ASICs.

“ROHM and Powervation share a common vision for the role of digital power technology in transforming the market with next-generation high performance power solutions,”

stated Mike Smith, SVP & GM of ROHM Semiconductor USA.

Since its founding in Ireland in 2006, as a University of Limerick spin-out, Powervation has established itself as a leading innovator in digital power controllers serving high performance Computing, Cloud and Communications infrastructure markets. The Company’s proprietary DSP control platform with patented xTune auto-tuning and ITM intelligent transient management technologies, has been adopted by industry leading customers who need advanced power management, precision telemetry/control and high efficiency solutions to power their complex multi-rail, multi-phase systems. Powervation delivers on these needs with further breakthroughs on design flexibility, fast time-to-market and lower total cost of ownership.

ROHM, a $3B global leader in analog and power semiconductors, supplies a diversified global customer base in the consumer, automotive and industrial markets. By acquiring Powervation, ROHM will gain leading-edge digital power technologies to strengthen its product offerings in the rapidly-growing cloud, data-center, and communications infrastructure markets. This acquisition will also enable ROHM to develop advanced digital power solutions for a broader range of markets and applications with Powervation’s flexible controller platform.

“The combination of our two companies will enable ROHM to develop industry-leading, integrated digital power solutions to serve a broad range of customers, markets, and applications spanning the entire spectrum from Computing and Communications to Consumer and Industrial,”

stated Jun Iida, head of LSI development and member of the ROHM board of directors.

Powervation will become a fully owned subsidiary of ROHM, with principal design center in Cork, Ireland and system application centers in San Jose, CA and Asia which fuse expertise in power systems, digital control, silicon and embedded software. ROHM plans to accelerate product development through investment and synergies with ROHM analog/discrete power technologies and to increase market adoption further by leveraging ROHM’s global customer base and channels.

“The Powervation team is excited to join forces with ROHM, a top 25 global semiconductor company,” said Mike McAuliffe, CEO of Powervation. “It’s simply a great fit – we have built an innovative Digital Power IC company to date but the combination with ROHM now presents a compelling opportunity for broad market leadership in Digital Power Management solutions.”

Hyundai-Kia America Technical Center, Inc., (HATCI) and Mojo Mobility, Inc., a wireless power technology company, have been awarded a funding grant from the U.S. Department of Energy’s (DOE) Office of Energy Efficiency and Renewable Energy (EERE), Vehicle Technologies (VT) program to research and develop a system capable of fast charging an electric vehicle wirelessly.  Mojo Mobility is known for developing highly efficient wireless charging systems capable of transferring high power without need for precise alignment between the charger and the vehicle.

“HATCI is honored to be selected as a partner with the DOE,” said Dr. Sung Hwan Cho, president, HATCI.  “Innovative technologies such as this align well with one of our core goals, which is to create a vehicle experience that is intuitive and easy for the consumer.”

The recent launch of the all-new 2015 Kia Soul EV, Kia’s first electric vehicle in the U.S. market, reflects the increasing prevalence of and demand for electro-mobility and its criticality to reducing petroleum consumption in the U.S. transportation sector.  Wireless charging technology has the potential to significantly enhance the convenience of electric vehicles – and thereby increase the appeal and acceptance among consumers – while possibly enabling smaller battery pack sizes and reduced vehicle weight.

HATCI and Mojo Mobility will develop, implement and demonstrate a wireless power transfer system on a test fleet of Kia Soul EVs over three phases, at HATCI in Superior Twp., Michigan, and Mojo Mobility in Santa Clara, California.

“We are delighted to partner with Kia and the U.S. DOE to bring the cutting-edge capabilities of our position-free wireless charging systems, which allow greater flexibility for vehicle alignment with the charging surface, to Kia Motors’ electric vehicles and accelerate their adoption and ease of use for consumers,”

said Dr. Afshin Partovi, CEO and founder of Mojo Mobility.

During Phase One, the partnership developed a wireless power transfer system that has more than 85 percent grid-to-vehicle efficiency and is capable of transferring in excess of 10 kW to the vehicle for fast charging. The new system will allow misalignment between the energy transmitter on the ground and the energy receiver on the vehicle, making it easier and more convenient for day-to-day usage.  In Phase Two, the partnership collaborated to integrate a compact system optimized for the Soul EV and demonstrate full operation at a record 92 percent efficiency.  Real-world performance data will be gathered in the third and final phase of the project using five Kia Soul EVs and corresponding energy transmission units.  This final phase will test the systems’ durability, interoperability, safety, and performance.

KMA and Mojo Mobility have not yet announced when the system will be available for purchase.

Cree, Inc. , a silicon-carbide (SiC) power and RF products manufacturer, today announced the acquisition of APEI, a  power modules and power electronics converter maker for harsh environment applications. Combining two highly complementary innovators, the acquisition enables Cree’s Power and RF business to extend its position.

This acquisition strengthens Cree’s position for SiC power electronics, infusing the Power and RF business with additional intellectual property and applications expertise at the systems level from APEI. In 2014, the co-development of a High-Performance Silicon Carbide-based Plug-In Hybrid Electric Vehicle Battery Charger on an ARPA-E program resulted in an R&D 100 award, recognizing the 100 most innovative technology advancements of the year for APEI.

 “Extending our research and development capabilities with APEI, a leader in wide bandgap power R&D, will help us accelerate delivery of a full spectrum of SiC power modules to meet customer requirements for performance and cost.”

said Frank Plastina, executive vice president, Cree Power and RF.

“Joining forces with the market leader in silicon-carbide power gives us an opportunity to commercialize our products faster,” said Dr. Alex Lostetter, president and CEO of APEI. “This ideal combination of chip technology and packaging will give us first-mover advantage, helping us to set the industry standard for power modules.”

The APEI team, now Cree Fayetteville, Inc., will continue to be based in Fayetteville, AR., and will operate as part of Cree’s Power and RF business. Under the terms of the agreement, Cree will acquire APEI in a merger transaction.

APEI is a leader in wide band gap semiconductor based power modules and power converters. They target harsh environment applications as military, aerospace, aeronautics or specialty vehicles.

 

Advanced Energy Industries, a power conversion system manufacturer, today announced that it has made a strategic decision to focus solely on its Precision Power business and slow down its Solar Inverter business, which is operated under AE Solar Energy Inc., AEI Power GmbH and their subsidiaries.

“Following on the heels of a strong 2014 and first quarter 2015 in Precision Power that reinforced the strength of our business model, and after an extensive strategic process over the last six months, we concluded that focusing solely on our Precision Power business, and exiting the Solar Inverter business aligns with our long-term goal of maximizing value for our shareholders,”

said Yuval Wasserman, President and CEO of Advanced Energy.

Over the past six months the company has engaged in a rigorous process exploring and evaluating various strategic alternatives for the Solar Inverter business, including a potential sale, joint venture, partnership, spin-off, licensing and other alternatives. To date, strategic discussions with third parties regarding the sale of the entire business have not provided sufficient value and terms that were in the best interest of shareholders, customers, employees and partners. Therefore, the company has made the decision to wind down the Solar Inverter business.
Advanced Energy expects to record a pre-tax charge of approximately $260 million to $290 million related to the wind down of the Solar Inverter business operations, the majority of which will be recorded in the second quarter of 2015. Of this write down, approximately $150 million relates to the impairment of goodwill and intangibles, $45 million to $75 million to the write down of inventory, fixed and other assets, $15 million for employee termination cost, $10 million for tax valuation allowances and the remaining $40 million for other costs to exit the business. Cash costs for severance and other expenses related to this decision are expected to range from $30 million to $45 million of which we expect $20 million to $30 million will be in 2015 with the remainder in subsequent years. These costs will be recorded as impairment and restructuring charges on the company’s income statement. The company plans to fund the cash costs through internally generated funds.