Infineon to launch new high-power module packaging standard
“Taking into account the increasing challenges IGBT technology is facing, we are very pleased to present a package that answers the needs of our industry both for today and for the foreseeable future.”
Infineon Technologies AG today announced the launch of two new power module platforms designed to improve the performance of high-voltage IGBTs in voltage classes from 1200V up to 6.5kV. To make the benefits of the new module broadly available, Infineon is offering a royalty-free license of the design to all providers of IGBT power modules. First products using the platform concept will include the high voltage classes 3.3kV (450A%